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IC Chip Tape Glue Preparation Machine YCGP-1
（Contact IC Chip Glue Applicator, Contact IC Card Machine, IC Chip Tape Glue Pastor, IC Card Machine ）
The machine is automatically controlled by PLC program. The imported high-quality stepper motor is used to transport IC module strip and hot melt glue for precise glue preparation. The production speed is fast and the glue preparation precision is high.
It is applicable to the preparation and processing of various types of contact IC chip or module tape (such as 6-pin chip and 8-pin chip).
Functional features
It integrates the transportation of IC module strip and hot melt adhesive strip, glue flushing, hot welding preparation and finished product collection.
5.the material belt will automatically discharge and receive materials. If there is no material in the feed, it will automatically alarm and shut down.
Technical Parameters
（Contact IC Chip Glue Applicator, Contact IC Card Machine, IC Chip Tape Glue Pastor, IC Card Machine ）
The machine is automatically controlled by PLC program. The imported high-quality stepper motor is used to transport IC module strip and hot melt glue for precise glue preparation. The production speed is fast and the glue preparation precision is high.
It is applicable to the preparation and processing of various types of contact IC chip or module tape (such as 6-pin chip and 8-pin chip).
Functional features
It integrates the transportation of IC module strip and hot melt adhesive strip, glue flushing, hot welding preparation and finished product collection.
- the hot welding glue preparation welding head adopts automatic correction and balance structure design, so that the glue preparation effect is better and the debugging is more convenient.
- the hot welding and glue punching molds are equipped with position fine-tuning mechanism, which makes the punching precision higher and the operation more convenient.
- reasonable mold structure design can ensure easy and convenient replacement. When preparing glue for different types of IC modules, it can be completed only by replacing the mold.
5.the material belt will automatically discharge and receive materials. If there is no material in the feed, it will automatically alarm and shut down.
Technical Parameters
| Power | AC220V 50/60 HZ | operator | 1 person |
| Main Power | Around 1.0 KW | Speed | 9000~12000chips/hour( 2 times of hot welding) |
| Compressed air | 6kg/cm²（dry oil free） | 15000~18000chips/hour( 1 time of hot welding) | |
| Air comsupmtion | Around 30L/min | Bonding mode | Hot melt glue（like Tesa 8410, Scapa G175 or similar） |
| NW | Around 400Kg | Module specification | ISO standard contact IC card chip tape (M3/8-pin & M2/6-pin） |
| Control mode | PLC+stepper system | Machine size | Around L1700×W800×H1600mm |
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